DolFin Releases a New Gaming Notebook!

As most of you know already, I am the owner and CEO of DolFin MicroDevices, a small computer company in Hastings Nebraska. I won’t use this blog to plug my brand and I will do my absolute best to keep my investment in DolFin from reducing the quality of my reviews. However, I do want to post the fact that we’ve released a new desktop replacement notebook. To avoid being accused of favoritism I will only post the raw data on this page. Just the specs pictures and other basic information and I will let you guys decide for yourselves weather it is good or not.

Today around 8:00PM DolFin MicroDevices Co. quietly updated it’s website www.dolfinmd.com with a new product that is much different from previous products on the site. The new DolFin RX1 appeared for $3999 and is touted as a desktop replacement gaming notebook. Here are the specs posted on the website:

CPU: Intel® Core™ i7-2720QM @2.2GHz
# of Cores: 4
TDP: 45w
Cooling system TDP: 55w
Cooler type: Copper plate phase change heat pipe.
GPU: NVIDIA® Geforce GTX560M, 1.5GB GDDR5 VRAM
GPU Cooler: Same as CPU
RAM: 16Gb Dual channel 4x4Gb @1333MHz
Display: 15.6″ LED-backlit LCD
Display Resolution: Full 1080p (1920 x 1080)
Storage: x2 256Gb Sata 6Gb/s SSD units
Optical Drive: SuperMulti DVDRW
Wireless: Bigfoot Killer™ Wireless-N 1103
Ports:
Monitor ( VGA ): 15 pin D-Sub x 1
HDMI: 1
USB 3.0: 2
USB 2.0: 2
eSATA: 1
Mic.-in: 1
Headphone-out: 1
Speakers: 2 Speakers: 2W x 2 + 1 Subwoofer

…and there you have it. That’s all I can say on this site. Let me know if you like it. Your opinions will be taken into consideration when I go to build the RX2 or whatever succeeds this one.

We’re Now Hosting the Store!!!

We are now hosting the Forrester store on this site to increase traffic on both this site and forrestertechnolgies.googlepages.com. Forrester Technologies is the company behind most of the money that supports this site. I (the writer) am the CEO of Forrester and use most of my paycheck to make sure this site is running and kept updated all of the time.We wanted a way to attract attention to both this site and the commercial site for Forrester Technologies without combining them or making them maintained for the same purpose. This is the first of many integratios you will see in the coming months but rest assured the site will not change dramatically outside of the store page.

Apple Patents Holographic Display

 On March 20, 2008 Apple was granted a patent on a holographic display technology. This would enable Mac users to display images in true 3-D. They stated that to do so would require much more computational power and bandwidth than most current computers. They also said in the application that the current 2-D systems are not adequate because, even with 3-D rendering they appear unrealistic and flat. Below are images and text clips from the actual patent application.

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Click images to enlarge.

Claims include:
A three-dimensional display system, comprising:providing a projection screen having a predetermined angularly-responsive reflective surface function;determining the left and right eye locations of at least one observer;projecting left and right three-dimensional sub-images toward the projection screen; andmodulating the sub-images respectively in coordination with the predetermined angularly-responsive reflective surface function to respectively direct the left and right sub-images substantially exclusively to the respective left and right eye locations.

A three-dimensional display system, comprising:providing a projection screen having a spatial filter defining a predetermined angularly-responsive reflective surface function;determining the left and right eye locations of at least one observer substantially facing and in proximity with the projection screen;projecting left and right sub-images of a three-dimensional image toward the projection screen; andangularly and intensity modulating the left and right sub-images respectively in coordination with the predetermined angularly-responsive reflective surface function to define respective discrete light paths that respectively direct the left and right sub-images to reflect from the projection screen substantially exclusively to the respective left and right eye locations to provide a three-dimensional viewing experience.

Descriptions include:
Although much more realistic, a dynamically presented holographic image also requires far greater computational ability and bandwidth than is generally required for a two-view stereo display. Effective means are also noticeably wanting for dynamically recreating the original wavefront, or an acceptable facsimile thereof, in real time and at commercially acceptable costs. Thus, a need still remains for highly effective, practical, efficient, uncomplicated, and inexpensive autostereoscopic 3D displays that allow the observer complete and unencumbered freedom of movement. Additionally, a need continues to exist for practical autostereoscopic 3D displays that provide a true parallax experience in both the vertical as well as the horizontal movement directions.

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Intel Announces USB 3!!!!!!

Here are two articles written by other bloggers then edited by me. If you are one of the other bloggers and do not want this content on this site you may email me at forrestersoftware@hotmail.com to tell me. I will take your content off imeadiatly.

Intel announces, demonstrates USB 3.0

By Joel Hruska | Published: September 18, 2007 – 10:12PM CT

One of the announcements to come out of the IDF keynote this afternoon was Pat Gelsinger’s discussion and demonstration of USB 3.0 technology. Although still in the prototype stage, USB 3.0 is aiming for 10 times the bandwidth of current USB2.0 solutions, or approximately 5Gbps. Since this requires fiber optic cabling, USB 3.0 will add a length of optical data cable to the mix, though USB 3.0 will retain full compatibility with USB 2.0 (and, one assumes, USB 1.0 as well).

Gelsinger expects the final version specifications to be finished by the first half of 2008, with USB 3.0 peripherals realistically appearing in 2009 or 2010. There are an increasing number of devices that could potentially take advantage of the additional bandwidth, including external hard drives, flash readers, video cameras, and the all-new USB-compliant llama expected to be genetically delivered from the Andes sometime in late 2011. Obviously a USB llama wouldn’t be much use without a USB 3.0 device—ever tried downloading from a llama over an old 10BaseT network? Yeah. It’d be worse.

As for the other, official features of USB 3.0, there remains quite a bit of information we don’t know, and it would have been nice for Intel to have included additional information. USB has long been criticized for relatively high CPU usage. This has inevitably become less of an issue as CPU performance has improved, but devices capable of using USB 3.0’s higher bandwidth capabilities could make CPU usage a problem again unless the issue is addressed during spec development. Issues like cable length, available power provided, and the number of devices per channel are all unrevealed as yet, and possibly unresolved. The Inquirer has a few more details on the spec (and the rest of the keynote) if you’re interested.

As far as future market competition, its target of 5Gbps puts USB 3.0 ahead of current eSATA (3Gbps), which is really the only other device protocol under active development that might challenge it as a peripheral interconnect. Although an IEEE 1394c protocol has been developed and published as of June 8 2007, no company has announced an intent to produce a product or chipset that utilizes the standard. FireWire remains supported in certain sectors, but I’d personally be surprised if the combination of USB 3.0 and eSATA doesn’t push FireWire out of the market completely. As for the nascent specification, the proposed 5Gbps speed is great and all, but hopefully the development committees will acknowledge some of the other concerns regarding the USB 2.0 protocol and incorporate solutions for them, rather than carrying them over into another product generation.

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Gelsinger demos USB 3.0, PICe 3.0 and other new toys
Intel Fall 007 Kicking ass

By Charlie Demerjian in San Francisco: Tuesday, 18 September 2007, 10:46 PM

PAT GELSINGER GAVE the afternoon keynote at IDF today, and it started off with some rather tame enterprise parts, then moved on to the fun stuff. First up was virtualisation, and a show and tell of the virtualisation vendors.

The one interesting one was presented by John Fowler of Sun with its upcoming, unannounced VM on its unannounced Tigerton/Caneland box. The most interesting bit is that, because it is running on Solaris,and you run Windows under that, the IO and storage are Solaris based and simply exposed. If you run Windows under Solaris, you get a real fault-tolerant file system on a toy OS.

The one time Itanium was mentioned was in a new Hitachi Virtage blade. This blade is running Montvale, aka Montecito v.07. Other than that, the red-headed step-chip was absent from just about everything.

Next was security, and they gave the quick rundown of VPro 2007 aka Weybridge. We told you all about it here, check it out if you are into virtualisation security. The next-gen VPro is called McCreary, coming in 2008. It will have a TPM v1.2 on the chipset, AMT 5.0 and a technology called Danbury. We will have a full write up on Danbury later today.

Going to I/O, we have the announcement of PCIe 3.0, Quickassist and USB3.0. PCIe 3.0 has twice the bandwidth – that would be 10Gbps – dynamic power management and supports accelerators. This used to be called Genesseo, but now has some marketing name related to Quickassist.

USB3.0 is probably going to be the biggest one of the bunch. They are aiming for 10-times the bandwidth, which would put it at about 5Gbps. For this you need optical, and USB 3.0 cables have an optical link in the current form. Backwards compatible, loads of bandwidth, optical and hopefully available in 1H/08.

Another optical link was the FCoE announcement, aka T11. It does just what it sounds like; puts fiber channel over vanilla ethernet. Intel has 10GigE adapters in copper and fiber for that, buy 12.

Then comes storage. Intel is getting into SSDs and they were showing of prototypes and vague specs. The specs were SATA 3.0, 10-50x the IOPs and a 4.5x power savings, all with twice the write speed. What this is over was not stated, but I don’t think it will be all that slow in any case.

Gelsinger then mentioned Skulltrail and pointed to a box without any more comment. There are several of these boxes at the show, so more info will be forthcoming.

The system diagrams for Nehalem were also shown off, but that is old news, see here and here. They then demo-ed probably the most important bit of the show, a 2S Nehalem system running. Getting one CPU up is easy, the second is much much harder with a new interconnect. Intel did it.

In general, there was a lot new here, more than can be covered in a single story. Much of it will be on your desktop in a year or two, most of it not esoteric server side technology. All I have to say looking back to the spring IDF is …. Yo! µ
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My thoughts.

My initial reaction to the new USB is wow 5 gb!!!!! Holy shit that’s a lot of data to go in one second. Then I thought about it and realized: Ya that’s fast but that number is not the actual speed you’ll get it is the original data throughput. Also I don’t think they will be able to deliver something quite that fast right away. From just over 400 megs to 5 gigs is a long way to jump overnight. I must admit that no matter what it’ll be fast and well worth installing in a machine. It’s just questionable weather they will actually deliver something as good as they say it is.

Good new computer for cheap

    The Forrester model C100 is auctioning on ebay for a reserve price of $300! This computer is very good for a casual gamer and is great for anyone who just wants to serf the web and get their job done. This computer is also excellent for those people who like to do lots of customizing, because it is a low priced machine that still has very good specs.

Here’s a list of the features:

80 gig hard drive

1 gig or high speed ram

2.66 ghtz processor

6 USB 2 ports and built-in networking

Auto overclocking that will automatically speed up your processor to get optimal performance and reliability

Logic board is specially designed so that the parts in the computer will not make very much noise and will last a very long time.

Here’s the link to the page on ebay!

http://cgi.ebay.com/ws/eBayISAPI.dll?ViewItem&ssPageName=STRK…